Processing

Please wait...

Settings

Settings

Goto Application

1. US5484569 - Silver palladium alloy

Office United States of America
Application Number 08289509
Application Date 12.08.1994
Publication Number 5484569
Publication Date 16.01.1996
Grant Number 5484569
Grant Date 16.01.1996
Publication Kind A
IPC
C22C 5/08
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
5Alloys based on noble metals
06Alloys based on silver
08with copper as the next major constituent
C22C 5/06
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
5Alloys based on noble metals
06Alloys based on silver
C22C 30/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
30Alloys containing less than 50% by weight of each constituent
C22C 30/02
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
30Alloys containing less than 50% by weight of each constituent
02containing copper
H01H 1/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
1Contacts
02characterised by the material thereof
H01H 1/023
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
1Contacts
02characterised by the material thereof
021Composite material
023having a noble metal as the basic material
CPC
C22C 30/02
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
30Alloys containing less than 50% by weight of each constituent
02containing copper
C22C 5/06
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
5Alloys based on noble metals
06Alloys based on silver
Applicants The J. M. Ney Company
Inventors Klein Arthur S.
Smith Edward F.
Agents Pepe & Hazard
Title
(EN) Silver palladium alloy
Abstract
(EN)

A silver/palladium alloy for electronic applications comprises, on a percent by weight basis, 35-60 silver, 20-44 palladium, 5-20 copper, 1-7 nickel, 0.1-5 zinc, to 0.18 boron, up to 0.05 rhenium and up to 1 percent by weight of modifying elements selected from the group consisting of ruthenium, zirconium and platinum. This alloy exhibits high oxidation and tarnish resistance and is formed into wrought electronic components such as contacts and brushes to provide low noise.