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1. (US4340902) Semiconductor device

Office : United States of America
Application Number: 06128354 Application Date: 12.07.1979
Publication Number: 4340902 Publication Date: 20.07.1982
Grant Number: 4340902 Grant Date: 20.07.1982
Publication Kind : A
Prior PCT appl.: Application Number:JP78000004 ; Publication Number: Click to see the data
IPC:
H01L 23/02
H01L 23/04
H01L 23/047
H01L 23/057
H01L 23/34
H01L 23/367
H01L 23/40
H01L 23/48
H01L 23/495
H01L 23/498
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
04
characterised by the shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
04
characterised by the shape
043
the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
047
the other leads being parallel to the base
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
04
characterised by the shape
053
the container being a hollow construction and having an insulating base as a mounting for the semiconductor body
057
the leads being parallel to the base
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367
Cooling facilitated by shape of device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
495
Lead-frames
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
CPC:
H01L 23/40
H01L 23/047
H01L 23/057
H01L 23/367
H01L 23/49541
H01L 23/498
H01L 23/49827
H01L 24/45
H01L 24/48
H01L 2224/45124
H01L 2224/48091
H01L 2224/48227
H01L 2224/48472
H01L 2924/00014
H01L 2924/01078
H01L 2924/01079
H01L 2924/14
H01L 2924/15153
H01L 2924/1517
H01L 2924/1532
H01L 2924/16195
Applicants: Fujitsu Limited
Inventors: Honda Norio
Sugahara Takehisa
Agents: Staas &; Halsey
Priority Data: 52138486 18.11.1977 JP
Title: (EN) Semiconductor device
Abstract: front page image
(EN)

A semiconductor device having a semiconductor chip (102), a ceramic base (101), a ceramic frame (105) and a cover (106). The ceramic base (101) is formed with a through hole. One side of said hole is covered by a high-heat conductivity metal plate (100). Said semiconductor chip (102) is mounted through a molybdenum plate (110) on the bottom of a recess formed by one side by said high-heat conductivity metal plate (100) and said through hole. A cooling means (107,108) is secured on said high-heat conductivity metal plate (100) opposite to the side for receiving the semiconductor chip (102).


Also published as:
WO/1979/000302