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1. US20220026483 - INDICATING A PROBING TARGET FOR A FABRICATED ELECTRONIC CIRCUIT

Office
United States of America
Application Number 17370958
Application Date 08.07.2021
Publication Number 20220026483
Publication Date 27.01.2022
Publication Kind A1
IPC
G01R 31/28
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
G01N 21/95
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws, defects or contamination
95characterised by the material or shape of the object to be examined
H01L 21/66
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
CPC
H01L 22/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
22Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
10Measuring as part of the manufacturing process
12for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
G01R 31/2818
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
2818using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
G01N 21/9503
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
95characterised by the material or shape of the object to be examined
9501Semiconductor wafers
9503Wafer edge inspection
Applicants Tektronix, Inc.
Inventors David Everett Burgess
Title
(EN) INDICATING A PROBING TARGET FOR A FABRICATED ELECTRONIC CIRCUIT
Abstract
(EN)

A method for indicating a probing target for a fabricated electronic circuit including: generating an electronic, three-dimensional model based on manufacturing layout information of a fabricated circuit; obtaining, with a vision system, visual environment information for the fabricated circuit; scaling and orienting the three-dimensional model by a scaler and mapper based on the visual environment information; overlaying the three-dimensional model with the visual environment information to produce a correlated image; obtaining an identification of a desired network node of the fabricated circuit; and indicating a probing target, the probing target corresponding to the desired network node of the fabricated circuit.


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