Processing

Please wait...

Settings

Settings

Goto Application

1. US20220011056 - Heat sink assembly for electronic equipment

Office
United States of America
Application Number 16922015
Application Date 07.07.2020
Publication Number 20220011056
Publication Date 13.01.2022
Grant Number 11300363
Grant Date 12.04.2022
Publication Kind B2
IPC
F28D 19/04
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
19Regenerative heat-exchange apparatus in which the intermediate heat-transfer medium or body is moved successively into contact with each heat-exchange medium
04using rigid bodies, e.g. mounted on a movable carrier
F28F 3/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
3Plate-like or laminated elements; Assemblies of plate-like or laminated elements
02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
F28F 5/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
5Elements specially adapted for movement
02Rotary drums or rollers
F28D 21/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
21Heat-exchange apparatus not covered by any of the groups F28D1/-F28D20/109
CPC
F28F 3/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
3Plate-like or laminated elements; Assemblies of plate-like or laminated elements
02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
F28D 19/04
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
19Regenerative heat-exchange apparatus in which the intermediate heat-transfer medium or body is moved successively into contact with each heat-exchange medium
04using rigid bodies, e.g. mounted on a movable carrier
F28F 5/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
5Elements specially adapted for movement
02Rotary drums or rollers
F28D 2021/0029
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
21Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
0028for cooling heat generating elements, e.g. for cooling electronic components or electric devices
0029Heat sinks
Applicants Cisco Technology, Inc.
Inventors Rohit Dev Gupta
Tilak Gaitonde
Prashanth Pavithran
Agents Edell, Shapiro & Finnan, LLC
Title
(EN) Heat sink assembly for electronic equipment
Abstract
(EN)

A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.


Related patent documents