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1. US20210331285 - POLISHING HEAD, WAFER POLISHING APPARATUS USING THE SAME, AND WAFER POLISHING METHOD USING THE SAME

Office
United States of America
Application Number 17055735
Application Date 13.02.2019
Publication Number 20210331285
Publication Date 28.10.2021
Publication Kind A1
IPC
B24B 37/32
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
27Work carriers
30for single side lapping of plane surfaces
32Retaining rings
B24B 7/22
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
7Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
20characterised by a special design with respect to properties of the material of non-metallic articles to be ground
22for grinding inorganic material, e.g. stone, ceramics, porcelain
B24B 57/02
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
57Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
02for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
B24B 37/10
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
04designed for working plane surfaces
07characterised by the movement of the work or lapping tool
10for single side lapping
CPC
B24B 37/107
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
07characterised by the movement of the work or lapping tool
10for single side lapping
105the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
107in a rotary movement only, about an axis being stationary during lapping
B24B 37/32
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
27Work carriers
30for single side lapping of plane surfaces
32Retaining rings
B24B 57/02
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
57Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
02for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
B24B 7/228
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
7Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
20characterised by a special design with respect to properties of the material of non-metallic articles to be ground
22for grinding inorganic material, e.g. stone, ceramics, porcelain
228for grinding thin, brittle parts, e.g. semiconductors, wafers
Applicants SUMCO CORPORATION
Inventors Yuki NAKANO
Katsuhisa SUGIMORI
Kazuaki KOZASA
Jiro KAJIWARA
Katsutoshi YAMAMOTO
Takayuki KIHARA
Ryoya TERAKAWA
Priority Data 2018095300 17.05.2018 JP
Title
(EN) POLISHING HEAD, WAFER POLISHING APPARATUS USING THE SAME, AND WAFER POLISHING METHOD USING THE SAME
Abstract
(EN)

A polishing head of a wafer polishing apparatus is provided with: a membrane head that can independently control a center control pressure pressing a center portion of a wafer, and an outer periphery control pressure pressing an outer peripheral portion of the wafer; an outer ring integrated with the membrane head so as to configure the outer peripheral portion of the membrane head; and a contact type retainer ring provided outside the membrane head. The membrane head has a central pressure chamber of a single compartment structure that controls the center control pressure, and an outer peripheral pressure chamber that is provided above the central pressure chamber, and that controls the outer periphery control pressure. A position of a lower end of the outer ring reaches at least a position of an inner bottom surface of the central pressure chamber.