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1. US20200175664 - Defect Classification by Fitting Optical Signals to a Point-Spread Function

Office United States of America
Application Number 16355584
Application Date 15.03.2019
Publication Number 20200175664
Publication Date 04.06.2020
Publication Kind A1
IPC
G06T 7/00
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
7Image analysis
G06T 7/62
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
7Image analysis
60Analysis of geometric attributes
62of area, perimeter, diameter or volume
G01N 21/95
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws, defects or contamination
95characterised by the material or shape of the object to be examined
CPC
G06T 7/62
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
7Image analysis
60Analysis of geometric attributes
62of area, perimeter, diameter or volume
G06T 7/001
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
7Image analysis
0002Inspection of images, e.g. flaw detection
0004Industrial image inspection
001using an image reference approach
G06T 2207/30148
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
2207Indexing scheme for image analysis or image enhancement
30Subject of image; Context of image processing
30108Industrial image inspection
30148Semiconductor; IC; Wafer
G06T 2207/10056
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
2207Indexing scheme for image analysis or image enhancement
10Image acquisition modality
10056Microscopic image
G01N 21/9501
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
95characterised by the material or shape of the object to be examined
9501Semiconductor wafers
Applicants KLA-Tencor Corporation
Inventors Soren Konecky
Bjorn Brauer
Title
(EN) Defect Classification by Fitting Optical Signals to a Point-Spread Function
Abstract
(EN)

A semiconductor die is inspected using an optical microscope to generate a test image of the semiconductor die. A difference image between the test image of the semiconductor die and a reference image is derived. For each defect of a plurality of defects for the semiconductor die, a point-spread function is fit to the defect as indicated in the difference image and one or more dimensions of the fitted point-spread function are determined. Potential defects of interest in the plurality of defects are distinguished from nuisance defects, based at least in part on the one or more dimensions of the fitted point-spread function for respective defects of the plurality of defects.

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