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1. (US20180375005) LIGHT-EMITTING DEVICE PACKAGE

Office : United States of America
Application Number: 16065431 Application Date: 18.11.2016
Publication Number: 20180375005 Publication Date: 27.12.2018
Publication Kind : A1
Prior PCT appl.: Application Number:PCTKR2016013317 ; Publication Number: Click to see the data
IPC:
H01L 33/62
H01L 33/64
H01L 33/40
H01L 25/075
H01L 33/50
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
64
Heat extraction or cooling elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36
characterised by the electrodes
40
Materials therefor
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
50
Wavelength conversion elements
CPC:
H01L 25/0753
H01L 33/405
H01L 33/50
H01L 33/62
H01L 33/641
Applicants: LG INNOTEK CO., LTD.
Inventors: Yun Soo SONG
Priority Data: 10-2015-0184714 23.12.2015 KR
Title: (EN) LIGHT-EMITTING DEVICE PACKAGE
Abstract:
(EN)

A light-emitting device package according to an embodiment may include a body; N (herein, N denotes a positive integer of 5 or more) upper pads disposed on the body to be spaced apart from each other; N-1 light-emitting device chips respectively arranged on N-1 upper pads among the N upper pads; and a plurality of first wires for electrically connecting the N-1 light-emitting device chips and the N upper pads to each other by at least one of a plurality of wiring structures.


Also published as:
WO/2017/111320