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1. (US20180277583) Packaged optical device with sealing resin and method of manufacturing packaged optical device

Office : United States of America
Application Number: 15994549 Application Date: 31.05.2018
Publication Number: 20180277583 Publication Date: 27.09.2018
Grant Number: 10319766 Grant Date: 11.06.2019
Publication Kind : B2
IPC:
H01L 27/146
H01L 23/02
H01L 27/14
H04N 5/225
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
CPC:
H01L 23/02
H01L 27/14625
H01L 27/14
H01L 27/14618
H01L 27/14621
H01L 27/14636
H04N 5/2253
H04N 5/2258
Applicants: MICRO MODULE TECHNOLOGY CO., LTD.
Inventors: Fumikazu Harazono
Agents: Nakanishi IP Associates, LLC
Priority Data: 2015-235357 02.12.2015 JP
Title: (EN) Packaged optical device with sealing resin and method of manufacturing packaged optical device
Abstract: front page image
(EN)

First, a three-dimensional substrate is placed such that the rear surface is oriented upward. Next, a translucent member is placed inside a recessed portion so as to cover a through-hole by bringing a first surface of the translucent member into contact with a protruding portion. Next, an element is placed on the rear surface of the three-dimensional substrate so as to cover the recessed portion. Next, a sealing resin is filled between three-dimensional substrate and the element, between the element and a second surface of the translucent member that opposes the first surface, between a side surface of the translucent member and the three-dimensional substrate, and between the first surface of the translucent member and the three-dimensional substrate. In this way, the element and the translucent member are integrated with the three-dimensional substrate.


Also published as:
CN108293088KR1020180090262WO/2017/094777