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1. (US20180034004) Encapsulation structures of OLED, encapsulation methods, and OLEDs

Office : United States of America
Application Number: 14914656 Application Date: 21.01.2016
Publication Number: 20180034004 Publication Date: 01.02.2018
Grant Number: 09905806 Grant Date: 27.02.2018
Publication Kind : B2
Prior PCT appl.: Application Number:PCTCN2016071543 ; Publication Number: Click to see the data
IPC:
H01L 51/52
H01L 23/31
H01L 23/29
H01L 51/56
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
CPC:
H01L 51/5268
H01L 23/291
H01L 23/293
H01L 23/3135
H01L 51/5253
H01L 51/5281
H01L 51/56
H01L 2251/5369
Applicants: Shenzhen China Star Optoelectronics Technology Co., Ltd.
Shenzhen China Star Optoelectronics Technology Co., Ltd
Inventors: Lixuan Chen
Agents: Andrew C. Cheng
Priority Data: 2015 1 0900239 09.12.2015 CN
Title: (EN) Encapsulation structures of OLED, encapsulation methods, and OLEDs
Abstract: front page image
(EN)

A OLED encapsulation structure includes: a first encapsulation layer; a second encapsulation arranged on one side of the first encapsulation layer; and scattering particles formed between the first encapsulation layer and the second encapsulation layer, and the scattering particles are configured to scatter incident lights. In addition, an encapsulation method of OLEDs and the OLEDs having the encapsulation structure are disclosed. The scattering particles are formed within the cathode encapsulation layer. The scattering particles may generate the scattering effect for the ambient lights or the stray lights to reduce the reflection of the light beams by the cathode. Thus, the brightness and the clearness of the OLED may be enhanced.


Also published as:
WO/2017/096696