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A multiple part electronic device is disclosed, the device comprising a first housing portion, a second housing portion, a connecting element that mechanically couples the first housing portion to the second housing portion, and a haptic element configured to induce a haptic effect arranged in at least one of the first housing portion or the second housing portion. The haptic element is in direct contact with the connecting element. The connecting element is a haptics guiding element configured to transmit the haptic effect between the first housing portion and the second housing portion.