Processing

Please wait...

Settings

Settings

Goto Application

1. US20160276242 - THERMAL SPREADER HAVING INTER-METAL DIFFUSION BARRIER LAYER

Office United States of America
Application Number 14664310
Application Date 20.03.2015
Publication Number 20160276242
Publication Date 22.09.2016
Publication Kind A1
IPC
H01L 23/34
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
F28F 21/08
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
21Constructions of heat-exchange apparatus characterised by the selection of particular materials
08of metal
CPC
H01L 23/34
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
Applicants Raytheon Company
Inventors Susan C. Trulli
Title
(EN) THERMAL SPREADER HAVING INTER-METAL DIFFUSION BARRIER LAYER
Abstract
(EN)

A heat spreader provided having: as ceramic substrate; and metallization layer structure disposed on at least one surface of the substrate. The metallization layer structure includes: a thick film layer disposed on the at least one surface of the substrate; a diffusion barrier layer on, and in direct contact with the thick film layer; and as heat conducting layer disposed on, and in direct contact with, the diffusion barrier layer. The diffusion barrier layer inhibits material in the thick film layer and material in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer. The metallization layer structure is disposed on a plurality of sides of the substrate.

Also published as