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1. US20150366114 - Support pin arrangement determination assisting method

Office
United States of America
Application Number 14764096
Application Date 29.01.2014
Publication Number 20150366114
Publication Date 17.12.2015
Grant Number 10219419
Grant Date 26.02.2019
Publication Kind B2
IPC
H05K 13/08
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
08Monitoring manufacture of assemblages
H05K 13/00
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
G06T 11/60
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
112D image generation
60Editing figures and text; Combining figures or text
G06F 17/50
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
17Digital computing or data processing equipment or methods, specially adapted for specific functions
50Computer-aided design
CPC
G06F 17/50
G06T 11/60
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
112D [Two Dimensional] image generation
60Editing figures and text; Combining figures or text
H05K 13/0061
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
H05K 13/0069
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
0069Holders for printed circuit boards
H05K 13/0076
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
0076Straightening or aligning terminal leads of pins mounted on boards, during transport of the boards
H05K 13/08
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
08Monitoring manufacture of assemblages
Applicants Panasonic Intellectual Property Management Co., Ltd.
Inventors Hirokazu Takehara
Takaaki Yokoi
Agents Pearne & Gordon LLP
Title
(EN) Support pin arrangement determination assisting method
Abstract
(EN)

A support pin arrangement determination assisting method includes displaying an image including a board image that indicates a shape and an arrangement of an already mounted component on the already mounted surface; inputting an arrangement position of the support pin to the displayed image; and displaying a composite image in which a pin arrangement image indicating the input arrangement position is superimposed on the board image. A planar image of the support pin in the pin arrangement image includes an image of a top portion of a shaft and an image of a contact portion which is located on a tip side of the top portion, which has a sectional shape smaller than that of the top portion, and which contacts and supports a lower surface of the board.