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1. TH145054 - ADHESIVE TAPE FOR SEMICONDUCTOR DEVICE DICING

Office
Thailand
Application Number 1401002109
Application Date 17.10.2012
Publication Number 145054
Publication Date 05.02.2016
Publication Kind A
IPC
H01L 21/301
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
Applicants ฟูรูคาวะ อีเลคทริค โก., แอลทีดี.
Inventors โอคาโมโตะ, คาซูยูกิ
โอตะ, ซาโตชิ
Agents นายจักรพรรดิ์ มงคลสิทธิ์, นางสาวปรับโยชน์ ศรีกิจจาภรณ์, นายรุทร นพคุณ
Priority Data PCT/JP2012/076865 17.10.2012 -
2011232278 21.10.2011 JP
Title
(EN) ADHESIVE TAPE FOR SEMICONDUCTOR DEVICE DICING
(TH) เทปที่มีสารยึดติดที่สามารถนำออกได้สำหรับการตัดอุปกรณ์สารกึ่งตัวนำ
Abstract
(EN) An adhesive tape (100) for semiconductor device dicing, which is obtained by forming a radiation-curable adhesive layer (20) on a base film (10). The base film (10) is formed of two or more base resin film layers. A base resin film layer (2) that is adjacent to the adhesive layer has a melting point of 100-120°C, while a base resin film layer (1) that is adjacent to the adhesive layer-side base resin film layer on the reverse side of the adhesive layer side has a melting point of 140-150°C.