TH145054 ADHESIVE TAPE FOR SEMICONDUCTOR DEVICE DICING

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Thailand

Application Number 1401002109

Application Date 17.10.2012

Publication Number 145054

Publication Date 05.02.2016

Publication Kind A

IPC

Applicants ฟูรูคาวะ อีเลคทริค โก., แอลทีดี.

Inventors โอคาโมโตะ, คาซูยูกิ
โอตะ, ซาโตชิ

Agents นายจักรพรรดิ์ มงคลสิทธิ์, นางสาวปรับโยชน์ ศรีกิจจาภรณ์, นายรุทร นพคุณ

Priority Data PCT/JP2012/076865 17.10.2012 -
2011232278 21.10.2011 JP

Title

(EN) ADHESIVE TAPE FOR SEMICONDUCTOR DEVICE DICING

(TH) เทปที่มีสารยึดติดที่สามารถนำออกได้สำหรับการตัดอุปกรณ์สารกึ่งตัวนำ

Abstract

(EN) An adhesive tape (100) for semiconductor device dicing, which is obtained by forming a radiation-curable adhesive layer (20) on a base film (10). The base film (10) is formed of two or more base resin film layers. A base resin film layer (2) that is adjacent to the adhesive layer has a melting point of 100-120Â°C, while a base resin film layer (1) that is adjacent to the adhesive layer-side base resin film layer on the reverse side of the adhesive layer side has a melting point of 140-150Â°C.

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18	the devices having semiconductor bodies comprising elements of group IV of the Periodic System or A_IIIB_V compounds with or without impurities, e.g. doping materials
30	Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301	to subdivide a semiconductor body into separate parts, e.g. making partitions

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18	the devices having semiconductor bodies comprising elements of group IV of the Periodic System or A_IIIB_V compounds with or without impurities, e.g. doping materials
30	Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301	to subdivide a semiconductor body into separate parts, e.g. making partitions

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1. TH145054 - ADHESIVE TAPE FOR SEMICONDUCTOR DEVICE DICING