(EN) An adhesive tape (100) for semiconductor device dicing, which is obtained by forming a radiation-curable adhesive layer (20) on a base film (10). The base film (10) is formed of two or more base resin film layers. A base resin film layer (2) that is adjacent to the adhesive layer has a melting point of 100-120°C, while a base resin film layer (1) that is adjacent to the adhesive layer-side base resin film layer on the reverse side of the adhesive layer side has a melting point of 140-150°C.