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1. (SG11201806631W) POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION

Office : Singapore
Application Number: 11201806631W Application Date: 05.02.2016
Publication Number: 11201806631W Publication Date: 27.09.2018
Publication Kind : A1
Prior PCT appl.: Application Number:PCTJP2016000618 ; Publication Number:2017134701 Click to see the data
IPC:
G03F 7/023
G03F 7/004
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
022
Quinonediazides
023
Macromolecular quinonediazides; Macromolecular additives, e.g. binders
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
CPC:
G03F 7/004
G03F 7/023
G03F 7/039
G03F 7/20
G03F 7/26
G03F 7/40
G03F 7/162
G03F 7/168
G03F 7/2004
G03F 7/322
Applicants: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
Inventors: MATSUKAWA, Daisaku
NAKAMURA, Tadamitsu
Priority Data:
Title: (EN) POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
Abstract:
Also published as:
CN108604059KR1020180101441EP3413132US20190049842PH1/2018/501573WO/2017/134701