(EN) MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING ABSTRACT 5Multiple bonding
layer schemes that temporarily join semiconductor substrates are provided.
In the inventive bonding scheme, at least one of the layers is directly in
contact with the semiconductor substrate and at least two layers within the
scheme are in direct contact with one another. The present invention
provides several processing options as the different layers within the
multilayer structure perform specific functions. More importantly, 10it
will improve performance of the thin-wafer handling solution by providing
higher thermal stability, greater compatibility with harsh backside
processing steps, protection of bumps on the front side of the wafer by
encapsulation, lower stress in the debonding step, and fewer defects on the
front side. 15Fig. 2