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1. RU0002690769 - LED PIXEL ELEMENT, LIGHT-EMITTING COMPONENT, LIGHT-EMITTING PANEL AND DISPLAY SCREEN

Office
Russian Federation
Application Number 2018105617
Application Date 06.08.2015
Publication Number 0002690769
Publication Date 05.06.2019
Grant Number
Grant Date 05.06.2019
Publication Kind C1
IPC
G09G 3/20
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
3Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
20for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
H01L 33/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
CPC
H01L 33/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 25/167
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 ; and H01L51/00; , e.g. forming hybrid circuits
167comprising optoelectronic devices, e.g. LED, photodiodes
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
G09F 2013/222
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
13Illuminated signs; Luminous advertising
20with luminescent surfaces or parts
22electroluminescent
222with LEDs
H01L 2224/48137
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
Inventors ЛИНЬ И (CN)
LIN Yi (CN)
Title
(EN) LED PIXEL ELEMENT, LIGHT-EMITTING COMPONENT, LIGHT-EMITTING PANEL AND DISPLAY SCREEN
(RU) Светодиодный пиксельный элемент, светоизлучающий компонент, светоизлучающая панель и экран дисплея
Abstract
(EN) FIELD: lighting engineering. SUBSTANCE: invention relates to the field of LED displays. LED pixel comprises driver integrated circuit and LED chip, wherein the LED chip is mounted on the surface of the driver integrated circuit, and the lead from the cathode of the LED chip is connected to the driver integrated circuit. On the crystal surface there is an insulating layer, and the contact platform located on the insulating layer is connected to the positive electrode. LED chip is installed on the contact platform, and the anode of the LED chip is electrically connected to the contact pad. EFFECT: wider range of tools for the same purpose. 15 cl, 16 dwg
(RU) Изобретение относится к области светодиодных дисплеев. Технический результат направлен на расширение арсенала средств того же назначения. Светодиодный пиксель содержит драйверную интегральную схему и светодиодный чип, при этом светодиодный чип установлен на поверхности драйверной интегральной схемы, а провод, идущий от катода светодиодного чипа, соединен с драйверной интегральной схемой. На поверхности кристалла расположен изолирующий слой, а контактная площадка, расположенная на изолирующем слое, соединена с положительным электродом. Светодиодный чип установлен на контактной площадке, а анод светодиодного чипа электрически соединен с контактной площадкой. 4 н. и 11 з.п. ф-лы, 16 ил.