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1. WO2019216190 - HEAT-CONDUCTIVE SHEET, MOUNTING METHOD USING SAME AND BONDING METHOD USING SAME

Publication Number WO/2019/216190
Publication Date 14.11.2019
International Application No. PCT/JP2019/017145
International Filing Date 23.04.2019
Chapter 2 Demand Filed 22.07.2019
IPC
B32B 27/26 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
18characterised by the use of special additives
26using curing agents
B32B 27/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
C08J 3/26 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
3Processes of treating or compounding macromolecular substances
24Crosslinking, e.g. vulcanising, of macromolecules
26of latex
C08K 3/013 2018.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
01characterised by their specific function
013Fillers, pigments or reinforcing additives
C08K 3/11 2018.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
10Metal compounds
11Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic System
C08L 101/00 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
CPC
B32B 2250/02
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2250Layers arrangement
022 layers
B32B 2250/24
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2250Layers arrangement
24All layers being polymeric
B32B 2250/248
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2250Layers arrangement
24All layers being polymeric
248All polymers belonging to those covered by group B32B25/00
B32B 2264/1023
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2264Composition or properties of particles which form a particulate layer or are present as additives
10Inorganic particles
102Oxide or hydroxide
1023Alumina
B32B 2307/302
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2307Properties of the layers or laminate
30having particular thermal properties
302Conductive
B32B 2307/306
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2307Properties of the layers or laminate
30having particular thermal properties
306Resistant to heat
Applicants
  • 富士高分子工業株式会社 FUJI POLYMER INDUSTRIES CO., LTD. [JP]/[JP]
Inventors
  • 菊池節夫 KIKUCHI Setsuo
  • 片石拓海 KATAISHI Takumi
Agents
  • 特許業務法人池内アンドパートナーズ IKEUCHI & PARTNERS
Priority Data
2018-08965508.05.2018JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) HEAT-CONDUCTIVE SHEET, MOUNTING METHOD USING SAME AND BONDING METHOD USING SAME
(FR) FEUILLE THERMOCONDUCTRICE, PROCÉDÉ DE MONTAGE METTANT EN ŒUVRE LADITE FEUILLE THERMOCONDUCTRICE ET PROCÉDÉ DE LIAISON METTANT EN ŒUVRE LADITE FEUILLE THERMOCONDUCTRICE
(JA) 熱伝導性シート、これを用いた実装方法及びこれを用いた接合方法
Abstract
(EN) In a heat-conductive sheet of the present invention, an uncured heat-conductive composition 2 not having a curing reaction catalyst is bonded to at least one main surface of a heat-conductive sheet 1 having a curing reaction catalyst. The heat-conductive sheet 1 having a curing reaction catalyst comprises a curing reaction catalyst in an amount required for curing the uncured heat-conductive composition. According to this mounting method, an uncured heat-conductive composition 1 not having a curing reaction catalyst is bonded to at least one main surface of a heat-conductive sheet 2 having a curing reaction catalyst, and the uncured heat-conductive composition is cured by diffusion of the curing reaction catalyst of the heat-conductive sheet 1 having a curing reaction catalyst. Therefore, just before mounting on electronic devices, it is possible to bond an uncured heat-conductive composition to a heat-conductive sheet, it is easy to follow protrusions and recesses on a heating part and/or heat radiating part, and it is possible to cure the uncured composition after mounting.
(FR) La présente invention concerne une feuille thermoconductrice, dans laquelle une composition thermoconductrice non durcie (2) ne possédant pas de catalyseur de réaction de durcissement est liée à au moins une surface principale d'une feuille thermoconductrice (1) possédant un catalyseur de réaction de durcissement. La feuille thermoconductrice (1) possédant un catalyseur de réaction de durcissement comprend un catalyseur de réaction de durcissement dans une quantité nécessaire pour durcir la composition thermoconductrice non durcie. Selon le procédé de montage, la composition thermoconductrice non durcie (1) ne possédant pas de catalyseur de réaction de durcissement est liée à au moins une surface principale d'une feuille thermoconductrice (2) possédant un catalyseur de réaction de durcissement, et la composition thermoconductrice non durcie est durcie par diffusion du catalyseur de réaction de durcissement de la feuille thermoconductrice (1) possédant un catalyseur de réaction de durcissement. Par conséquent, juste avant le montage sur des dispositifs électroniques, il est possible de lier une composition thermoconductrice non durcie à une feuille thermoconductrice, il est facile de suivre les saillies et les renfoncements sur une partie de chauffage et/ou sur une partie de rayonnement de chaleur, et il est possible de durcir la composition non durcie après montage.
(JA) 本発明の熱伝導性シートは、硬化反応触媒を含有した熱伝導性シート1の少なくとも一主面に、硬化反応触媒を含有しない熱伝導性未硬化組成物2が接合されており、前記硬化反応触媒を含有した熱伝導性シート1は、前記熱伝導性未硬化組成物を硬化させるため必要な量の硬化反応触媒を含む。本発明の実装方法は、硬化反応触媒を含有した熱伝導性シート2の少なくとも一主面に、硬化反応触媒を含有しない熱伝導性未硬化組成物1を接合し、前記硬化反応触媒を含有した熱伝導性シート1の硬化反応触媒の拡散により、前記熱伝導性未硬化組成物を硬化させる。これにより、電子部品等へ実装する直前に、熱伝導性未硬化組成物を熱伝導性シートに接合でき、発熱部及び/又は放熱部の凹凸に追従しやすく、実装後に前記未硬化組成物を硬化することができる。
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