Processing

Please wait...

Settings

Settings

Goto Application

1. MYPI 2014700959 - REMOVABLE ADHESIVE TAPE FOR DICING A SEMICONDUCTOR DEVICE

Office
Malaysia
Application Number PI 2014700959
Application Date 17.10.2012
Publication Number PI 2014700959
Publication Date 21.04.2013
Publication Kind A
IPC
H01L 21/301
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 201/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201Adhesives based on unspecified macromolecular compounds
C09J 7/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
02on carriers
Applicants FURUKAWA ELECTRIC CO., LTD.
Inventors OKAMOTO, KAZUYUKI
OTA, SATOSHI
Agents ZARAIHAN BT SHAARI
Priority Data 2011232278 21.10.2011 JP
Title
(EN) REMOVABLE ADHESIVE TAPE FOR DICING A SEMICONDUCTOR DEVICE
Abstract
(EN) A REMOVABLE ADHESIVE TAPE (100) FOR DICING A SEMICONDUCTOR DEVICE, CONTAINING A RADIATION-CURABLE REMOVABLE ADHESIVE LAYER (20) FORMED ON THE SUBSTRATE FILM (10), IN WHICH THE SUBSTRATE FILM (10) CONTAINS TWO OR MORE SUBSTRATE RESIN FILM LAYERS, A SUBSTRATE RESIN FILM LAYER (2) ADJACENT TO THE REMOVABLE ADHESIVE LAYER HAS A MELTING POINT OF 100 TO 120?C, AND A SUBSTRATE RESIN FILM LAYER (1) THAT IS ADJACENT TO THE ABOVE SUBSTRATE RESIN FILM LAYER (2) ADJACENT TO THE REMOVABLE ADHESIVE LAYER (20), POSITIONED AT THE OPPOSITE SIDE OF THE REMOVABLE ADHESIVE LAYER (20), HAS A MELTING POINT OF 140?C TO 150?C. FIGURE 1.