MYPI 2014700959 REMOVABLE ADHESIVE TAPE FOR DICING A SEMICONDUCTOR DEVICE

Settings

Stemming

Single Family Member

Include NPL

Feedback

Goto Application

National Biblio. Data
Patent Family

Office

Malaysia

Application Number PI 2014700959

Application Date 17.10.2012

Publication Number PI 2014700959

Publication Date 21.04.2013

Publication Kind A

IPC

Applicants FURUKAWA ELECTRIC CO., LTD.

Inventors OKAMOTO, KAZUYUKI
OTA, SATOSHI

Agents ZARAIHAN BT SHAARI

Priority Data 2011232278 21.10.2011 JP

Title

(EN) REMOVABLE ADHESIVE TAPE FOR DICING A SEMICONDUCTOR DEVICE

Abstract

(EN) A REMOVABLE ADHESIVE TAPE (100) FOR DICING A SEMICONDUCTOR DEVICE, CONTAINING A RADIATION-CURABLE REMOVABLE ADHESIVE LAYER (20) FORMED ON THE SUBSTRATE FILM (10), IN WHICH THE SUBSTRATE FILM (10) CONTAINS TWO OR MORE SUBSTRATE RESIN FILM LAYERS, A SUBSTRATE RESIN FILM LAYER (2) ADJACENT TO THE REMOVABLE ADHESIVE LAYER HAS A MELTING POINT OF 100 TO 120?C, AND A SUBSTRATE RESIN FILM LAYER (1) THAT IS ADJACENT TO THE ABOVE SUBSTRATE RESIN FILM LAYER (2) ADJACENT TO THE REMOVABLE ADHESIVE LAYER (20), POSITIONED AT THE OPPOSITE SIDE OF THE REMOVABLE ADHESIVE LAYER (20), HAS A MELTING POINT OF 140?C TO 150?C. FIGURE 1.

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18	the devices having semiconductor bodies comprising elements of group IV of the Periodic System or A_IIIB_V compounds with or without impurities, e.g. doping materials
30	Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301	to subdivide a semiconductor body into separate parts, e.g. making partitions

C	CHEMISTRY; METALLURGY
09	DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J	ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201	Adhesives based on unspecified macromolecular compounds

C	CHEMISTRY; METALLURGY
09	DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J	ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7	Adhesives in the form of films or foils
02	on carriers

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18	the devices having semiconductor bodies comprising elements of group IV of the Periodic System or A_IIIB_V compounds with or without impurities, e.g. doping materials
30	Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301	to subdivide a semiconductor body into separate parts, e.g. making partitions

C	CHEMISTRY; METALLURGY
09	DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J	ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201	Adhesives based on unspecified macromolecular compounds

Processing

National Phase Entries

Authority File

Settings

Feedback

Goto Application

1. MYPI 2014700959 - REMOVABLE ADHESIVE TAPE FOR DICING A SEMICONDUCTOR DEVICE