(EN) A REMOVABLE ADHESIVE TAPE (100) FOR DICING A SEMICONDUCTOR DEVICE, CONTAINING A RADIATION-CURABLE REMOVABLE ADHESIVE LAYER (20) FORMED ON THE SUBSTRATE FILM (10), IN WHICH THE SUBSTRATE FILM (10) CONTAINS TWO OR MORE SUBSTRATE RESIN FILM LAYERS, A SUBSTRATE RESIN FILM LAYER (2) ADJACENT TO THE REMOVABLE ADHESIVE LAYER HAS A MELTING POINT OF 100 TO 120?C, AND A SUBSTRATE RESIN FILM LAYER (1) THAT IS ADJACENT TO THE ABOVE SUBSTRATE RESIN FILM LAYER (2) ADJACENT TO THE REMOVABLE ADHESIVE LAYER (20), POSITIONED AT THE OPPOSITE SIDE OF THE REMOVABLE ADHESIVE LAYER (20), HAS A MELTING POINT OF 140?C TO 150?C. FIGURE 1.