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1. (MYPI 2011003455) RESIN COMPOSITE COPPER FOIL

Office : Malaysia
Application Number: PI 2011003455 Application Date: 10.12.2009
Publication Number: PI 2011003455 Publication Date: 26.06.2010
Publication Kind : A
Prior PCT appl.: Application Number:PCTJP2009071005 ; Publication Number: Click to see the data
IPC:
B32B 15/088
H05K 1/09
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
088
comprising polyamides
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC.
PI R&D CO., LTD.
Inventors: NOZAKI, MITSURU
OOMORI, TAKABUMI
NOMOTO, AKIHIRO
AKIYAMA, NORIKATSU
NAGATA, EIJI
YANO, MASASHI
Agents: PATRICK MIRANDAH
Priority Data: 2008-334408 26.12.2008 JP
Title: (EN) RESIN COMPOSITE COPPER FOIL
Abstract:
(EN) THIS INVENTION RELATES TO A RESIN COMPOSITE COPPER FOIL CAPABLE OF APPLYING A COPPER FOIL WITH VERY SMALL UNEVENNESS ON A COPPER FOIL (MATTE) SURFACE WITHOUT DETERIORATING ADHESION FORCE TO A RESIN COMPOSITION OF A COPPER-CLAD LAMINATE, AND MORE PARTICULARLY TO A RESIN COMPOSITE COPPER FOIL COMPRISING A COPPER FOIL AND A POLYIMIDE RESIN LAYER WHEREIN THE POLYIMIDE RESIN LAYER CONTAINS A SPECIFIC BLOCK COPOLYMERIZED POLYIMIDE RESIN AND AN INORGANIC FILLER.
Also published as:
EP2371536JPWO2010073952US20110281126CN102264539KR1020110100300KR1020170042670
WO/2010/073952