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1. (MYPI 2011002883) RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL-CLAD, LAMINATE, PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE

Office : Malaysia
Application Number: PI 2011002883 Application Date: 22.12.2009
Publication Number: PI 2011002883 Publication Date: 25.06.2010
Publication Kind : A
Prior PCT appl.: Application Number:PCTJP2009071334 ; Publication Number: Click to see the data
Applicants: SUMITOMO BAKELITE COMPANY, LTD.
Inventors: UMENO, KUNIHARU
Agents: CHARMAYNE ONG POH YIN
Priority Data: 2008-329012 25.12.2008 JP
Title: (EN) RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL-CLAD, LAMINATE, PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE
Abstract:
(EN) DISCLOSED IS A RESIN COMPOSITION EXHIBITING A LOW THERMAL EXPANSION COEFFICIENT, AS WELL AS HIGHER HEAT RESISTANCE, FLAME RESISTANCE AND INSULATION RELIABILITY THAN EVER BEFORE WHEN USED IN A MULTILAYER PRINTED WIRING BOARD THAT REQUIRES FINE WIRING WORK. ALSO DISCLOSED ARE A PREPREG, A RESIN SHEET, A METAL-CLAD LAMINATE, A PRINTED WIRING BOARD, A MULTILAYER PRINTED WIRING BOARD AND A SEMICONDUCTOR DEVICE, ALL OF WHICH COMPRISING THE RESIN COMPOSITION. THE RESIN COMPOSITION OF THE PRESENT INVENTION COMPRISES (A) AN EPOXY RESIN, (B) A CYANATE RESIN AND (C) AN ONIUM SALT COMPOUND AS ESSENTIAL COMPONENTS.
Also published as:
JPWO2010074085US20110255258CN102264793KR1020110117061WO/2010/074085