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1. KR1020090007467 - POSITIVE RESIST COMPOSITION AND METHOD FOR FORMATION OF RESIST PATTERN

Office Republic of Korea
Application Number 1020087029148
Application Date 28.11.2008
Publication Number 1020090007467
Publication Date 16.01.2009
Grant Number 1009984630000
Grant Date 06.12.2010
Publication Kind B1
IPC
G03F 7/039
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
039Macromolecular compounds which are photodegradable, e.g. positive electron resists
Applicants TOKYO OHKA KOGYO CO., LTD.
Inventors TAKESHITA MASARU
WATANABE RYOJI
Priority Data 2006 2006145285 25.05.2006 JP
2006 2006244293 25.05.2006 JP
Title
(EN) POSITIVE RESIST COMPOSITION AND METHOD FOR FORMATION OF RESIST PATTERN
Abstract
(EN)
Disclosed is a positive resist composition, which comprises: a resin component (A) whose alkali solubility can be improved by the action of an acid; and an acid-generator component (B) which can generate an acid upon being exposed to light, wherein the resin component (A) has a constituent unit (a0-1) represented by the general formula (a0-1) and a constituent unit (a0-2) represented by the general formula (a0-2)[in the general formulae, R represents a hydrogen atom, a halogen atom, a lower alkyl group or a halogenated lower alkyl group; Y ┬ęKIPO&WIPO 2009