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1. KR1020080098008 - CONNECTION STRUCTURE OF PHOTOELECTRIC FLEXIBLE WIRING BOARD, CONNECTOR AND PHOTOELECTRIC FLEXIBLE WIRING BOARD

Office
Republic of Korea
Application Number 1020087018239
Application Date 24.07.2008
Publication Number 1020080098008
Publication Date 06.11.2008
Grant Number 1012745470000
Grant Date 13.06.2013
Publication Kind B1
IPC
H01R 12/24
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
14Coupling devices
24specially adapted for flexible printed circuits or flat or ribbon cables
Applicants HOSIDEN K.K.
Inventors KONDO HAYATO
NAGATA TAKAYUKI
Priority Data 2006 2006027689 03.02.2006 JP
2006165020 14.06.2006 JP
Title
(EN) CONNECTION STRUCTURE OF PHOTOELECTRIC FLEXIBLE WIRING BOARD, CONNECTOR AND PHOTOELECTRIC FLEXIBLE WIRING BOARD
Abstract
(EN)
[PROBLEMS]To miniaturize a photoelectric flexible wiring board by lengthening the optical transmission line on the photoelectric flexible wiring board, and to attain excellent flexibility and optical transmission characteristics.[MEANS FOR SOLVING PROBLEMS]Optical elements (45, 55) performing photoelectric conversion on a photoelectric flexible wiring board (30) and their drivers (60, 70) are removed from the photoelectric flexible wiring board (30). The optical elements (45, 55) are mounted on connectors (40, 50) for connecting the photoelectric flexible wiring board (30) with mounting substrates (12, 22). The drivers (60, 70) are mounted on the mounting substrates (12, 22) together with the connectors (40, 50). ┬ęKIPO&WIPO 2009