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1. KR1020080086912 - PHENOL RESIN AND RESIN COMPOSITIONS

Office
Republic of Korea
Application Number 1020087018095
Application Date 23.07.2008
Publication Number 1020080086912
Publication Date 26.09.2008
Grant Number 1010115990000
Grant Date 27.01.2011
Publication Kind B1
IPC
C08G 8/28
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
8Condensation polymers of aldehydes or ketones with phenols only
28Chemically modified polycondensates
C08G 8/10
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
8Condensation polymers of aldehydes or ketones with phenols only
04of aldehydes
08of formaldehyde, e.g. of formaldehyde formed in situ
10with phenol
C08L 61/06
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
61Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
04Condensation polymers of aldehydes or ketones with phenols only
06of aldehydes with phenols
Applicants HITACHI CHEMICAL COMPANY, LTD.
Inventors SUE HARUAKI
SATOU KUNIAKI
MATSUZAKA OSAMU
Priority Data 2006 2006016212 25.01.2006 JP
Title
(EN) PHENOL RESIN AND RESIN COMPOSITIONS
Abstract
(EN)
The invention provides a phenol resin having the structure represented by formula (1) in the backbone skeleton as a constituent unit and resin compositions containing the same. The phenol resin can easily be epoxidized, chemically modified, or reacted with epoxy resin or the like. According to the invention, various phenol resins from a low-molecular one rich in fluidity to a high-softening one can be synthesized, which is industrially useful. When the phenol resin is used as a curing agent for epoxy resin or the like, the resulting resin composition can give a cured article having a high Tg without impairing the adhesiveness. ┬ęKIPO&WIPO 2008