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1. (KR1020080028464) PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER

Office : Republic of Korea
Application Number: 1020087002351 Application Date: 29.01.2008
Publication Number: 1020080028464 Publication Date: 31.03.2008
Publication Kind : A
IPC:
G03F 7/028
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028
with photosensitivity-increasing substances, e.g. photoinitiators
CPC:
G03F 7/0751
C08K 5/0025
C08K 5/544
G03F 7/0045
G03F 7/0226
G03F 7/0755
Y10S 430/106
Y10S 430/111
Y10S 430/115
Y10S 430/117
Applicants: TORAY INDUSTRIES, INC.
Inventors: YUBA TOMOYUKI
FUJITA YOJI
TOMIKAWA MASAO
Priority Data: 2005 2005191346 30.06.2005 JP
Title: (EN) PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER
Abstract:
(EN) A photosensitive resin composition comprising alkali soluble resin (a), silicon compound (b) having secondary aromatic amino and alkoxyl and at least one member (c) selected from among a photopolymerization initiator, a photoacid generator and a photobase generator. Thus, there can be obtained a photosensitive resin composition that without detriment to the storage stability of solution, strikingly enhances the adhesion with substrate after curing and even at development, is free from micropattern peeling. ┬ęKIPO&WIPO 2008
Also published as:
EP1909142JPWO2007004345US20090123867CN101213491JP5087923WO/2007/004345