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1. KR1020080023313 - A METHOD OF MANUFACTURING A MEMS ELEMENT

Office
Republic of Korea
Application Number 1020077030318
Application Date 26.12.2007
Publication Number 1020080023313
Publication Date 13.03.2008
Publication Kind A
IPC
B81C 1/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
CPC
B81C 1/00182
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00134comprising flexible or deformable structures
00182Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
B81B2203/0118
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
01Suspended structures, i.e. structures allowing a movement
0118Cantilevers
B81B2203/0315
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
03Static structures
0315Cavities
B81C 1/00047
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00023without movable or flexible elements
00047Cavities
B81C2201/0109
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
2201Manufacture or treatment of microstructural devices or systems
01in or on a substrate
0101Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
0102Surface micromachining
0105Sacrificial layer
0109Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
Applicants KONINKLIJKE PHILIPS ELECTRONICS N.V.
코닌클리케 필립스 일렉트로닉스 엔.브이.
Inventors DEKKER RONALD
덱커, 로날드
LANGEREIS GEERT
랑제르에이스, 기어트
POHLMANN HAUKE
폴맨, 하우크
DUEMLING MARTIN
두엠링, 마르틴
Agents 문경진
Priority Data 05105869.1 30.06.2005 EP
Title
(EN) A METHOD OF MANUFACTURING A MEMS ELEMENT
(KO) MEMS 구성요소 제조 방법
Abstract
(EN) The device (100) comprises a substrate (10) of a semiconductor material with a first and an opposite second surface (1,2) and a microelectromechanical (MEMS) element (50) which is provided with a fixed and a movable electrode (52, 51) that is present in a cavity (30). One of the electrodes (51,52) is defined in the substrate (10). The movable electrode (51) is movable towards and from the fixed electrode (52) between a first gapped position and a second position. The cavity (30) is opened through holes (18) in the substrate (10) that are exposed on the second surface (2) of the substrate (10). The cavity (30) has a height that is defined by at least one post (15) in the substrate (10), which laterally substantially surrounds the cavity (15). ©KIPO&WIPO 2008
(KO) 디바이스(100)는 제1 및, 이에 대향하는 제2 표면을 갖는 반도체 물질의 기판(10) 그리고, 고정 전극(52) 및, 공동(30)에 존재하는 이동 가능한 전극(51)을 갖춘 MEMS 구성요소(50)를 포함한다. 상기 전극(51, 52) 중 하나는 기판(10)에서 한정된다. 상기 이동 가능한 전극(51)은 제1 및 제2 갭이 있는 위치 사이의 고정 전극(52)으로/고정 전극으로부터 이동 가능하다. 이 공동(30)은 기판(10)의 제2 표면(2) 상에 노출된 기판(10) 속의 홀(hole)(18)을 통해 개방된다. 이 공동(30)은 공동(15)을 측면으로 실질적으로 둘러싸는 기판(10)에 적어도 하나의 포스트(15)에 의해 한정되는 높이를 갖는다.