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1. KR1020210076953 - 패키징 방법 및 패키징 구조

Office
Republic of Korea
Application Number 1020217014491
Application Date 18.03.2019
Publication Number 1020210076953
Publication Date 24.06.2021
Publication Kind A
IPC
B81C 1/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
B81B 7/02
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
CPC
B81C 1/00269
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00261Processes for packaging MEMS devices
00269Bonding of solid lids or wafers to the substrate
B81B 7/02
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
B81C 1/00301
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00261Processes for packaging MEMS devices
00301Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
Applicants 닝보 세미컨덕터 인터내셔널 코포레이션
Inventors 양, 티앤룬
Agents 특허법인씨엔에스
Title
(KO) 패키징 방법 및 패키징 구조
Abstract
(KO)
본 발명은 패키징 방법 및 패키징 구조를 제공하며, 상기 패키징 방법에서, 먼저 캡 웨이퍼에 요홈을 형성하고, 상기 요홈에 희생층이 형성되며, 그 다음 상기 희생층에서 제1 소자를 제조하고, 역 설치된 방식을 사용하여 제1 소자가 형성되는 상기 캡 웨이퍼의 표면을 기판 웨이퍼에 본딩하여, 상기 캡 웨이퍼의 제1 소자의 밀봉 및 이와 기판 웨이퍼의 제2 소자의 전기학 연결을 구현하고, 그 후 희생층을 제거하여 상기 제1 소자의 활동에 필요한 캐비티를 형성한다. 본 발명의 기술적 해결수단은 두 개의 웨이퍼를 사용하여 기존 세 개의 웨이퍼 패키징 구조를 완성할 수 있고, 원가를 절감하며 제품의 집적도를 향상시키고 공정의 난이도를 감소시킨다.

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