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1. KR1020190055084 - 카메라 모듈, 제조 방법 및 전자기기

Office
Republic of Korea
Application Number 1020197007444
Application Date 08.09.2017
Publication Number 1020190055084
Publication Date 22.05.2019
Grant Number 102413918
Grant Date 27.06.2022
Publication Kind B1
IPC
G03B 17/02
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
02Bodies
G03B 17/55
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
55with provision for heating or cooling, e.g. in aircraft
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
CPC
G03B 17/02
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
02Bodies
G03B 17/55
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
55with provision for heating or cooling, e.g. in aircraft
H05K 1/0203
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
H05K 1/0281
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0277Bendability or stretchability details
028Bending or folding regions of flexible printed circuits
0281Reinforcement details thereof
Applicants 소니 세미컨덕터 솔루션즈 가부시키가이샤
Inventors 모미우치 유타
타카오카 유지
나카야마 히로카즈
타나카 키요히사
토가와 미요시
세키 히로카즈
Agents 이광직
윤승환
Priority Data JP-P-2016-185347 23.09.2016 JP
Title
(KO) 카메라 모듈, 제조 방법 및 전자기기
Abstract
(KO) 본 기술은, 광학 모듈의 위치 정밀도나 방열성의 저하를 억제할 수 있도록 하는 카메라 모듈, 제조방법 및 전자기기에 관한 것이다. 촬상 소자는, 그 촬상 소자의 수광면이, 플렉시블 기판의 개구부가 노출되도록, 플렉시블 기판의 일방의 면에 접합되고, 광학 모듈은, 개구부를 거쳐서, 촬상 소자에 광을 입사시키도록, 플렉시블 기판의 타방의 면에 접합되어 있다. 보강부재는, 플렉시블 기판의 일방의 면의, 촬상 소자의 주위에 접합되어, 광학 모듈이 접합되는 플렉시블 기판의 접합부분을 보강한다. 보강부재는, 접합부분의 적어도 일부를 포함한 범위에 대향하도록 접합되며, 촬상 소자의 주위의 일부가 개구하도록 구성된다. 본 기술은, 예를 들면, 촬상 소자와 광학 모듈이 일체가 된 카메라 모듈에 적용할 수 있다.