Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (KR1020190038755) 마스킹 디바이스를 비접촉식으로 부상시키기 위한 방법

Office : Republic of Korea
Application Number: 1020187030185 Application Date: 26.09.2017
Publication Number: 1020190038755 Publication Date: 09.04.2019
Publication Kind : A
Prior PCT appl.: Application Number: ; Publication Number:WO2019063062 Click to see the data
IPC:
H01L 51/56
H01L 21/02
H01L 21/677
H01L 21/68
H01L 51/00
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56
Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68
for positioning, orientation or alignment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
CPC:
H01L 51/56
H01L 21/02631
H01L 21/67709
H01L 21/67712
H01L 21/67751
H01L 21/682
H01L 51/0018
Applicants: 어플라이드 머티어리얼스, 인코포레이티드
Inventors: 애들러, 티모
Agents: 특허법인 남앤남
Priority Data:
Title: (KO) 마스킹 디바이스를 비접촉식으로 부상시키기 위한 방법
Abstract: front page image
(KO) 방법은 마스크 조립체(200)를 비접촉식으로 부상시키는 단계를 포함한다. 마스크 조립체는 캐리어(210), 및 캐리어에 의해 지지된 마스킹 디바이스(20)를 포함한다. 방법은 마스크 조립체가 비접촉식으로 부상되어 있는 동안에 캐리어의 형상을 제어하는 단계를 포함한다.
Also published as:
CN109844163WO/2019/063062