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1. KR1020180110019 - 절연 피복 도전 입자, 이방 도전성 접착제, 및 접속 구조체

Office Republic of Korea
Application Number 1020187025418
Application Date 06.02.2017
Publication Number 1020180110019
Publication Date 08.10.2018
Publication Kind A
IPC
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
16
comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
C
TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES; PREPARATION OF CARBON BLACK
3
Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
12
Treatment with organosilicon compounds
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
04
inorganic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
11
Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
01
characterised by the form or arrangement of the conductive interconnection between their connecting locations
H01B 5/16
C09C 3/12
C09J 11/04
C09J 7/00
C09J 9/02
H01B 1/22
Applicants 히타치가세이가부시끼가이샤
Inventors 나카가와, 마사시
아카이, 구니히코
에지리, 요시노리
야마자키, 쇼헤이
와타나베, 야스시
Agents 장수길
오현식
Priority Data JP-P-2016-023927 10.02.2016 JP
Title
(KO) 절연 피복 도전 입자, 이방 도전성 접착제, 및 접속 구조체
Abstract
(KO)
미소한 회로의 접속에 있어서도, 우수한 절연 신뢰성 및 도통 신뢰성을 양립할 수 있는 절연 피복 도전 입자를 제공한다. 절연 피복 도전 입자(100a)는, 도전 입자(1)와, 도전 입자(1)의 표면에 부착된 복수의 절연 입자(210)를 구비한다. 도전 입자(1)의 평균 입경은, 1㎛ 이상 10㎛ 이하이다. 절연 입자(210)는, 200㎚ 이상 500㎚ 이하의 평균 입경을 갖는 제1 절연 입자(210a)와, 30㎚ 이상 130㎚ 이하의 평균 입경을 갖고, 실리카를 포함하는 제2 절연 입자(210b)를 포함한다.