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1. KR1020180018712 - LED화소점, 발광부재, 발광패널 및 디스플레이 스크린

Office
Republic of Korea
Application Number 1020187001096
Application Date 06.08.2015
Publication Number 1020180018712
Publication Date 21.02.2018
Grant Number 102104126
Grant Date 23.04.2020
Publication Kind B1
IPC
H01L 25/075
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/78
CPC
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 25/0756
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0756Stacked arrangements of devices
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Applicants 린, 이
Inventors 린, 이
Agents 특허법인다나
Title
(KO) LED화소점, 발광부재, 발광패널 및 디스플레이 스크린
Abstract
(KO) 본 발명은 LED 화소점에 관한 것으로, 이는 구동 IC(20) 및 LED 칩(40)을 포함하고; 상기 LED 칩(40)은 상기 구동 IC(20)의 표면에 적층되어 장착되며 상기 LED 칩(40)의 음극에서 인출한 와이어(31)는 상기 구동 IC(20)에 연결되며, 상기 구동 IC(20)는 패키징되지 않은 베어 다이이며; 상기 베어 다이의 표면에는 절연층이 설치되고 상기 절연층의 상방에는 양전극에 연결되는 본딩 패드(30)가 설치되며, 상기 LED 칩(40)은 상기 본딩 패드(30)에 장착되고 상기 LED 칩(40)의 양극은 상기 본딩 패드(30)에 전기적으로 연결된다. 본 발명의 LED 화소점은 LED 디스플레이 제품의 투광률을 향상시킨다.