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1. KR1020110006012 - ANISOTROPIC CONDUCTIVE ADHESIVES FOR ULTRASONIC BONDING CAPABLE OF MAINTAINING A TEMPERATURE REGARDLESS OF THICKNESS AND AREA OF THE ADHESIVE, AND AN ELECTRICAL INTERCONNECTION METHOD OF ELECTRONIC COMPONENTS USING THE SAME

Office Republic of Korea
Application Number 1020090063434
Application Date 13.07.2009
Publication Number 1020110006012
Publication Date 20.01.2011
Grant Number 1010256200000
Grant Date 30.03.2011
Publication Kind B1
IPC
C09J 9/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
C09J 5/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
02involving pretreatment of the surfaces to be joined
Applicants KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
한국과학기술원
Inventors PAIK, KYUNG WOOK
백경욱
LEE, KI WON
이기원
KIM, SEUNG HO
김승호
Agents 권오식
김종관
박창희
Title
(EN) ANISOTROPIC CONDUCTIVE ADHESIVES FOR ULTRASONIC BONDING CAPABLE OF MAINTAINING A TEMPERATURE REGARDLESS OF THICKNESS AND AREA OF THE ADHESIVE, AND AN ELECTRICAL INTERCONNECTION METHOD OF ELECTRONIC COMPONENTS USING THE SAME
(KO) 초음파 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법
Abstract
(EN)
PURPOSE: An anisotropic conductive adhesive is provided to reduce constant resistance between two electrodes, to allow a bulk of current to flow, and to prevent thermal transformation of electronic components. CONSTITUTION: An anisotropic conductive adhesive includes: an insulating polymer resin(430); bonding particles(410) which is welded by heat generated by ultrasonic wave applied to the anisotropic conductive adhesive; and spacer particles(420) with a melting point higher than that of the bonding particles. COPYRIGHT KIPO 2011

(KO)
본 발명은 제1 전자부품의 접속부 전극인 제1전극과 제2 전자부품의 접속부 전극인 제2전극을 전기적으로 접속시키는 이방성 전도성 접착제(ACA; Anisotropic Conductive Adhesives)에 관한 것으로, 본 발명에 따른 초음파 접합용 이방성 전도성 접착제는 절연성 폴리머 수지; 상기 이방성 전도성 접착제에 인가되는 초음파에 의해 발생하는 열에 의해 용융되는 전도성 접합 입자; 및 상기 접합 입자보다 높은 녹는점(melting point)을 갖는 스페이서(spacer) 입자;를 함유하며, 상기 접합 입자가 용융되어 상기 접합 입자와 상기 제1전극 및 상기 제2전극에서 하나 이상 선택된 전극과 면접촉하고 상기 스페이서 입자에 의해 상기 제1전극과 상기 제2전극간 일정한 간극이 유지되어 상기 제1전극과 상기 제2전극이 전기적으로 접속되는 특징이 있다.