Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (KR1020170042670) 수지 복합 동박

Office : Republic of Korea
Application Number: 1020177006656 Application Date: 10.12.2009
Publication Number: 1020170042670 Publication Date: 19.04.2017
Grant Number: 1018174980000 Grant Date: 11.01.2018
Publication Kind : B1
Prior PCT appl.: Application Number: ; Publication Number:WO2010073952 Click to see the data
IPC:
B32B 15/088
B32B 15/20
C08G 73/10
H05K 1/09
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
088
comprising polyamides
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
20
comprising aluminium or copper
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
CPC:
H05K 3/386
H05K2201/0154
H05K2201/0209
H05K2201/0358
Y10T 428/31681
Applicants: 미츠비시 가스 가가쿠 가부시키가이샤
피아이 알 앤 디 컴파니, 리미티드
Inventors: 노자키, 미츠르
오오모리, 타카부미
노모토, 아키히로
아키야마, 노리카츠
나가타, 에이지
야노, 마사시
Agents: 특허법인태백
Priority Data: JP-P-2008-334408 26.12.2008 JP
Title: (KO) 수지 복합 동박
Abstract: front page image
(KO) 본 발명은 동장 적층판의 수지 조성물 간의 접착력을 손상시키지 않으면서 동박(매트) 면 상에 매우 작은 요철을 갖는 동박의 적용이 가능한 수지 복합 동박에 관한 것으로, 보다 상세하게는 동박과 폴리이미드 수지층을 구비하며 상기 폴리이미드 수지층이 특정한 블록 공중합 폴리이미드 수지와 무기 충진체를 함유하는 수지 복합 동박에 관한 것이다.
Also published as:
EP2371536JPWO2010073952US20110281126CN102264539KR1020110100300MYPI 2011003455
WO/2010/073952