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1. (KR1020150033392) EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT

Office : Republic of Korea
Application Number: 1020130113360 Application Date: 24.09.2013
Publication Number: 1020150033392 Publication Date: 01.04.2015
Grant Number: 1015256760000 Grant Date: 03.06.2015
Publication Kind : B1
IPC:
H01G 4/30
H05K 3/46
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4
Fixed capacitors; Processes of their manufacture
30
Stacked capacitors
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants: 삼성전기주식회사
SAMSUNG ELECTRO-MECHANICS CO., LTD.SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventors: KIM, HYE SEONGKIM, HYE SEONG
JUNG, HEE JUNGJUNG, HEE JUNG
김혜성
정희정
Agents: 특허법인씨엔에스
Priority Data:
Title: (EN) EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT
(KO) 기판 내장용 적층 세라믹 전자부품, 그 제조방법 및 적층 세라믹 전자부품 내장형 인쇄회로기판
Abstract: front page image
(EN) The present invention relates to an embedded multilayer ceramic electronic component and a manufacturing method thereof. More particularly, the present invention relates to an embedded multilayer ceramic electronic component and a manufacturing method thereof. The embedded multilayer ceramic electronic component has an external electrode band surface of a constant distance or more to connect an external line through a via hole and reduces the thickness of the external electrode and increases the thickness of the ceramic body, thereby improving the strength of a chip and preventing the generation of breakage. COPYRIGHT KIPO 2015
(KO) 본 발명은 기판 내장용 적층 세라믹 전자부품 및 그 제조방법에 관한 것으로, 보다 상세하게는 외부의 배선을 비아 홀을 통해 연결시키기 위한 일정 길이 이상의 외부전극 밴드 면을 형성하면서도 외부전극의 두께를 낮추어 칩 전체에 있어서의 세라믹 본체의 두께를 향상시킴으로써 칩의 강도를 향상시키고, 깨짐 등의 파손 발생을 방지할 수 있는 기판 내장용 적층 세라믹 전자부품 및 그 제조방법에 관한 것이다.