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1. (KR1020110117061) 수지 조성물, 프리프레그, 수지 시트, 금속 부착 적층판, 프린트 배선판, 다층 프린트 배선판 및 반도체 장치

Office : Republic of Korea
Application Number: 1020117014538 Application Date: 22.12.2009
Publication Number: 1020110117061 Publication Date: 26.10.2011
Grant Number: 1015266450000 Grant Date: 05.06.2015
Publication Kind : B1
Prior PCT appl.: Application Number:PCTJP2009071334 ; Publication Number:WO2010074085 Click to see the data
IPC:
C08L 63/00
C08G 59/50
C08J 5/24
H05K 1/03
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
50
Amines
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
24
Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
CPC:
C08L 63/00
C08G 59/50
C08J 5/24
H05K 1/03
C08G 59/688
H05K 1/0373
H05K 3/4626
Applicants: 스미토모 베이클리트 컴퍼니 리미티드
Inventors: 우메노 구니하루
Agents: 특허법인태평양
Priority Data: JP-P-2008-329012 25.12.2008 JP
Title: (KO) 수지 조성물, 프리프레그, 수지 시트, 금속 부착 적층판, 프린트 배선판, 다층 프린트 배선판 및 반도체 장치
Abstract: front page image
(KO) 본 발명은 미세 배선 가공이 요구되는 다층 프린트 배선판에 이용했을 때에 저열팽창률이고, 종래보다도 더욱 높은 내열성, 내연성, 뛰어난 절연 신뢰성을 발현할 수 있는 수지 조성물, 상기 수지 조성물을 이용한 프리프레그, 수지 시트, 금속 부착 적층판, 프린트 배선판, 다층 프린트 배선판 및 반도체 장치를 제공한다. 본 발명의 수지 조성물은 (A) 에폭시 수지, (B) 시아네이트 수지 및 (C) 오늄염 화합물을 필수 성분으로서 함유한다.
Also published as:
JPWO2010074085US20110255258CN102264793MYPI 2011002883WO/2010/074085