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1. KR1020110118616 - 전단-보조 탄성 스탬프 전사에 의한 프린팅 반도체 소자

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Republic of Korea
Application Number 1020117014025
Application Date 19.11.2009
Publication Number 1020110118616
Publication Date 31.10.2011
Grant Number 1017367220000
Grant Date 17.05.2017
Publication Kind B1
IPC
H01L 21/027
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
CPC
H01L 21/027
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
H01L 21/6835
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
6835using temporarily an auxiliary support
H01L 24/75
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
75Apparatus for connecting with bump connectors or layer connectors
H01L 24/83
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
83using a layer connector
H01L 24/95
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
93Batch processes
95at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
H01L 21/67092
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67092Apparatus for mechanical treatment
Applicants 셈프리어스 아이엔씨.
셈프리어스 아이엔씨.
Inventors 메날드, 에띠앙
메날드, 에띠앙
Agents 이원희
이원희
Priority Data 61/116,136 19.11.2008 US
Title
(KO) 전단-보조 탄성 스탬프 전사에 의한 프린팅 반도체 소자
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Abstract
(KO) 수신 기판에 반도체 소자의 전사 프린팅을 위한 방법 및 장치를 제공한다. 일 측면에서, 프린팅은 반도체 소자에서 잉크로 칠해진 탄성 중합체 스탬프와 수신 기판 사이에 등각 접촉으로 이루어지고, 스탬프 제거 동안, 전단 오프셋이 스탬프와 수신 기판 사이에 적용된다. 전단-오프셋 프린팅 처리는 좋은 배치 정밀도와 함께 높은 프린팅 전사 이득을 획득한다. 스탬프-백킹 압력 적용 및 수직 변위를 다양하게 하는 시간을 포함하는, 전사 프린팅 동안 처리 파라미터 선택은 수반하는 전사 프린팅 개선으로 충분히 일정한 박리(delamination) 비율을 생기게 한다.
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