Processing

Please wait...

Settings

Settings

Goto Application

1. KR1011428140000* - 저은 땜납 합금 및 땜납 페이스트 조성물

Office Republic of Korea
Application Number 1020117029543
Application Date 12.05.2011
Publication Number 1011428140000*
Publication Date 27.04.2012
Grant Number 1011428140000
Grant Date 27.04.2012
Publication Kind B1
IPC
C22C 13/02
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
02with antimony or bismuth as the next major constituent
B23K 35/26
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400°C
CPC
C22C 13/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
C22C 13/02
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
02with antimony or bismuth as the next major constituent
B23K 35/262
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400 degrees C
262Sn as the principal constituent
Inventors 이마무라 요지
이케다 카즈키
피아오 진유
타케모토 타다시
Agents 하영욱
Priority Data JP-P-2010-242916 29.10.2010 JP
Title
(KO) 저은 땜납 합금 및 땜납 페이스트 조성물
Abstract
(KO)
본 발명의 저은 땜납 합금은 은이 0.05~2.0질량%, 구리가 1.0질량% 이하, 안티몬이 3.0질량% 이하, 비스무트가 2.0질량% 이하, 인듐이 4.0질량% 이하, 니켈이 0.2질량% 이하, 게르마늄이 0.1질량% 이하, 코발트가 0.5질량% 이하(단, 상기 구리, 안티몬, 비스무트, 인듐, 니켈, 게르마늄, 및 코발트는 각각 0질량%가 아니다), 및 잔부가 주석으로 이루어진다. 본 발명에 의하면, Ag의 함유량을 저감시켜서 비용을 억제함과 아울러 우수한 신장, 융점, 강도 등을 갖고, 또한 높은 내피로성(내냉열피로성)을 갖는 장기간 신뢰할 수 있는 저은 땜납 합금을 제공할 수 있다.

Also published as
MXMX/a/2011/011353