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1. (KR1020140083580) PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Office : Republic of Korea
Application Number: 1020120153495 Application Date: 26.12.2012
Publication Number: 1020140083580 Publication Date: 04.07.2014
Publication Kind : A
IPC:
H01L 23/12
H05K 3/46
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
CPC:
H01L 24/81
H01L 24/11
H01L 24/83
H05K 1/113
H05K 3/0097
H01L 24/32
H05K 2201/0376
H05K 2203/1536
Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD.
삼성전기주식회사
Inventors: 노승현
이동욱
김영곤
NOH, SEUNG HYUN
LEE, DONG UK
KIM, YOUNG GON
Agents: NOH, SEUNG HYUN
LEE, DONG UK
KIM, YOUNG GON
김창달
Priority Data:
Title: (EN) PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
(KO) 인쇄회로기판 및 그 제조방법
Abstract:
(EN) A printed circuit board and a method for manufacturing the same are disclosed. The printed circuit board includes a core layer; a metal bump which is embedded in the core layer and of which one surface is opened to the outside; and a solder resist layer which is disposed on the core layer and includes an opening part. The printed circuit board solves a problem of an empty space between the bumps without a new solder resist process by using a separation substrate manufacturing method and filling the empty space between the bumps with an insulating material rather than solder resist. COPYRIGHT KIPO 2014
(KO) 인쇄회로기판 및 그 제조방법이 개시된다. 코어층; 상기 코어층에 매립되며, 일면이 외부에 개방된 금속 범프; 및 상기 코어층 상에 위치하며, 개구부가 형성된 솔더 레지스트층을 포함하는 인쇄회로기판은 분리 기판 제작 방법을 이용하고 솔더 레지스트가 아닌 절연물질로 범프 사이의 빈공간을 충진함으로써 신규 솔더 레지스트 프로세스 없이도 범프 간 빈공간이 생기는 문제를 해결할 수 있는 효과가 있다.