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1. KR1020070094625 - CONDUCTIVE PASTE

Office
Republic of Korea
Application Number 1020077016173
Application Date 13.07.2007
Publication Number 1020070094625
Publication Date 20.09.2007
Grant Number 1010863580000
Grant Date 23.11.2011
Publication Kind B1
IPC
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 1/09
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the metallic pattern
CPC
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 1/095
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the ; conductive, e.g. ; metallic pattern
092Dispersed materials, e.g. conductive pastes or inks
095for polymer thick films, i.e. having a permanent organic polymeric binder
H05K 3/4069
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
4038Through-connections; Vertical interconnect access [VIA] connections
4053by thick-film techniques
4069for via connections in organic insulating substrates
Applicants FUJIKURA KASEI CO., LTD.
ASAHI KASEI EMD CORPORATION
후지쿠라 가세이 가부시키가이샤
아사히 가세이 일렉트로닉스 가부시끼가이샤
Inventors HIRAKAWA YOHEI
히라카와, 요헤이
WAKABAYASHI KATSUTOMO
와카바야시, 카츠토모
YOTSUYANAGI YUTA
요츠야나기, 유타
TANAKA NORIHITO
타나카, 노리히토
Agents 박상수
Priority Data JP-P-2005-00016965 25.01.2005 JP
Title
(EN) CONDUCTIVE PASTE
(KO) 도전성 페이스트
Abstract
(EN)

A conductive paste having an excellent conductivity and an excellent conductive connection reliability contains a binder containing a thermosetting resin, and conductive particles. The lowest heat generation peak temperature T1 (degrees C) among at least one heat generation peak obtained by a differential scanning calorie measurement of the binder and the lowest heat absorption peak temperature t 1 (degrees C) among at least one heat absorption peak obtained by the differential scanning calorie measurement of the conductive particles satisfy the following relationship: t1-20 < T1...(1).

© KIPO & WIPO 2007

(KO)
열경화성 수지를 함유하는 바인더와 도전성 입자를 포함하며, 상기 바인더의 시차주사 열량측정에 의해 적어도 1개 이상의 발열 피크 중 가장 저온의 발열 피크 온도 T(℃)와 상기 도전성 입자의 시차주사 열량측정에 의해 적어도 1개의 흡열 피크 중 가장 저온의 흡열 피크 온도 t(℃)가 t-20