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1. (JPWO2010073952) 樹脂複合銅箔

Office : Japan
Application Number: 2010544022 Application Date: 10.12.2009
Publication Number: WO2010073952 Publication Date: 01.07.2010
Grant Number: 5641942 Grant Date: 07.11.2014
Publication Kind : B2
IPC:
B32B 15/08
B32B 15/088
H05K 1/03
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
088
comprising polyamides
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants: 三菱瓦斯化学株式会社
株式会社ピーアイ技術研究所
Inventors: 野崎 充
大森 貴文
野本 昭宏
秋山 教克
永田 英史
矢野 真司
Agents: 杉村 憲司
冨田 和幸
Priority Data: 2008334408 26.12.2008 JP
Title: (JA) 樹脂複合銅箔
Abstract:
(JA)

本発明は、銅張積層板の樹脂組成物との接着力を損なわずに、銅箔(マット)面の凹凸の極めて小さい銅箔の適用が可能な樹脂複合銅箔に関し、より詳しくは、銅箔とポリイミド樹脂層とを具え、該ポリイミド樹脂層が特定のブロック共重合ポリイミド樹脂と無機充填剤とを含有する、樹脂複合銅箔に関するものである。


Also published as:
EP2371536US20110281126CN102264539KR1020110100300KR1020170042670MYPI 2011003455
WO/2010/073952