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1. (JP4742279) 温度測定装置及びこれを利用した熱処理装置、温度測定方法

Office : Japan
Application Number: 2007524074 Application Date: 04.07.2006
Publication Number: 4742279 Publication Date: 10.08.2011
Grant Number: 4742279 Grant Date: 10.08.2011
Publication Kind : B2
Prior PCT appl.: Application Number:WOJP2006313304 ; Publication Number:WO2007004644 Click to see the data
IPC:
G01K 11/12
G06F 17/30
H01L 21/66
G PHYSICS
01
MEASURING; TESTING
K
MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
11
Measuring temperature based on physical or chemical changes not covered by group G01K3/, G01K5/, G01K7/, or G01K9/202
12
using change of colour or translucency
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
17
Digital computing or data processing equipment or methods, specially adapted for specific functions
30
Information retrieval; Database structures therefor
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
CPC:
G01K 11/125
H01L 21/67248
Applicants: 国立大学法人広島大学; 広島県東広島市鏡山1丁目3番2号
Inventors: 東 清一郎
Priority Data: 2005195691 05.07.2005 JP
2007524074 04.07.2006 JP
JP2006313304 04.07.2006 WO
Title: (JA) 温度測定装置及びこれを利用した熱処理装置、温度測定方法
Abstract:
Also published as:
KR1020080031046EP1909083US20100086006CN101218492WO/2007/004644