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1. JPWO2020111274 - 電子機器

Office
Japan
Application Number 2020557885
Application Date 29.11.2019
Publication Number WO2020111274
Publication Date 04.06.2020
Publication Kind A1
IPC
H05K 7/20
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
G06F 1/20
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/-G06F13/82
16Constructional details or arrangements
20Cooling means
CPC
G06F 1/20
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
20Cooling means
H05K 7/20163
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20009using a gaseous coolant in electronic enclosures
20136Forced ventilation, e.g. by fans
20154Heat dissipaters coupled to components
20163the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
H05K 7/209
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2089for power electronics, e.g. for inverters for controlling motor
209Heat transfer by conduction from internal heat source to heat radiating structure
H05K 7/20909
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2089for power electronics, e.g. for inverters for controlling motor
20909Forced ventilation, e.g. on heat dissipaters coupled to components
Applicants 株式会社ソニー・インタラクティブエンタテインメント
Inventors 鳳 康宏
Agents 弁理士法人はるか国際特許事務所
Priority Data 2018225447 30.11.2018 JP
Title
(JA) 電子機器
Abstract
(JA)

電子機器(10)は、ヒートシンク(30)に空気を送る複数の冷却ファン(15)を有している。複数の冷却ファン(15)によって、ヒートシンク(30)の第1の側(H1)から第2の側(H2)に向けてヒートシンク(30)を通過する空気流(Fh)が形成される。ヒートシンク(30)は電子機器(10)の左右方向と前後方向とに対して斜めに配置されている。外装部材(40)は、ヒートシンク(30)の第1の側(H1)に沿って前後方向と左右方向とに対して斜めに形成されている吸気口(41i)を有している。


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