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1. JP2022037423 - 半導体製造装置、測定装置及び半導体製造方法

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Office
Japan
Application Number 2020141552
Application Date 25.08.2020
Publication Number 2022037423
Publication Date 24.03.2021
Grant Number 6857431
Grant Date 24.03.2021
Publication Kind B1
IPC
H01L 21/677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
H01L 21/66
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66Testing or measuring during manufacture or treatment
CPC
H01L 21/677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
H01L 22/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
22Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Applicants 株式会社写真化学
Inventors 堀江　正浩
Agents 特許業務法人Ｒ＆Ｃ
Title
(JA) 半導体製造装置、測定装置及び半導体製造方法
front page image
Abstract
(JA) 【課題】ウェハに所定の処理を施すとともに所定の処理が施されたウェハの状態を検査できる技術であって、従来よりも利便性に優れ、比較的単純な構成で実現可能な半導体製造装置を提供する。
【解決手段】処理室内でウェハに所定の処理を施す処理装置と、搬送室を形成する筐体と、搬送室内に配置され、ウェハを搬送する搬送機構と、搬送室を形成する筐体に取り付けられた複数のロードポートと、複数のロードポートのうちの少なくとも一つに着脱自在に気密状に取り付けられる搬送容器と、測定室２６ａ内に配置された測定器３５を備え、搬送容器が取り付けられるロードポートとは異なるロードポート１０ｄに着脱自在に気密状に取り付けられ、所定の処理が施されたウェハの状態を測定する測定装置２５とを備え、搬送機構は、搬送容器から搬出したウェハを処理室内に搬入し、所定の処理が施されたウェハを処理室から搬出して測定室２６ａ内に搬入する。
【選択図】図１２
Related patent documents
WO/2022/044490
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