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1. JP2020107140 - TEMPERATURE CONTROL DEVICE

Office
Japan
Application Number 2018246199
Application Date 27.12.2018
Publication Number 2020107140
Publication Date 09.07.2020
Grant Number 7203600
Grant Date 04.01.2023
Publication Kind B1
IPC
G05D 23/19
GPHYSICS
05CONTROLLING; REGULATING
DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
23Control of temperature
19characterised by the use of electric means
CPC
F25B 21/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT-PUMP SYSTEMS
21Machines, plant, or systems, using electric or magnetic effects
02using Peltier effect; using Nernst-Ettinghausen effect
F24H 15/414
H01L 21/67017
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
H01L 21/67109
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67098Apparatus for thermal treatment
67109mainly by convection
G05D 23/1919
GPHYSICS
05CONTROLLING; REGULATING
DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
23Control of temperature
19characterised by the use of electric means
1919characterised by the type of controller
G05D 23/1931
GPHYSICS
05CONTROLLING; REGULATING
DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
23Control of temperature
19characterised by the use of electric means
1927using a plurality of sensors
193sensing the temperaure in different places in thermal relationship with one or more spaces
1931to control the temperature of one space
Applicants KELK LTD
株式会社KELK
Inventors MIMURA KAZUHIRO
三村 和弘
KOBAYASHI ATSUSHI
小林 敦
Agents 弁理士法人酒井国際特許事務所
Title
(EN) TEMPERATURE CONTROL DEVICE
(JA) 温度制御装置
Abstract
(EN)

PROBLEM TO BE SOLVED: To accurately adjust the temperature of a fluid.

SOLUTION: A temperature control device comprises: a smoothing device having a first inlet into which a fluid flows, a smoothing passage through which the fluid flowing in from the first inlet flows, and a first outlet from which the fluid flowing through the smoothing passage flows out, the smoothing device making an amount of temperature change of the fluid in the first outlet smaller than an amount of temperature change of the fluid in the first inlet; a temperature adjustment device having a second inlet into which the fluid flowing out from the first outlet flows, a temperature adjustment passage through which the fluid flowing in from the second inlet flows, a temperature adjustment unit that adjusts a temperature of the fluid flowing through the temperature adjustment passage, and a second outlet from which the fluid flowing through the temperature adjustment passage flows out; a first temperature sensor that detects the temperature of the fluid at a first position set in the smoothing passage; a second temperature sensor that detects the temperature of the fluid at a second position further downstream than the second outlet; a feed forward control unit that, based on detection data from the first temperature sensor, calculates an amount of temperature adjustment made by the temperature adjustment unit; and a feedback control unit that, based on detection data from the second temperature sensor, calculates an amount of temperature adjustment made by the temperature adjustment unit.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2020,JPO&INPIT


(JA)

【課題】流体の温度を精度良く調整すること。
【解決手段】温度制御装置は、流体が流入する第1入口、第1入口から流入した流体が流通する平滑化流路、及び平滑化流路を流通した流体が流出する第1出口を有し、第1出口における流体の温度変動量を第1入口における流体の温度変動量よりも小さくする平滑器と、第1出口から流出した流体が流入する第2入口、第2入口から流入した流体が流通する温調流路、温調流路を流通する流体の温度を調整する温調部、及び温調流路を流通した流体が流出する第2出口を有する温調器と、平滑化流路に設定された第1位置において流体の温度を検出する第1温度センサと、第2出口よりも下流の第2位置において流体の温度を検出する第2温度センサと、第1温度センサの検出データに基づいて、温調部による温度調整量を算出するフィードフォワード制御部と、第2温度センサの検出データに基づいて、温調部による温度調整量を算出するフィードバック制御部と、を備える。
【選択図】図1