Processing

Please wait...

Settings

Settings

Goto Application

1. JP2020504302 - 検査用プローブ及びソケット

Office
Japan
Application Number 2019536173
Application Date 11.01.2018
Publication Number 2020504302
Publication Date 06.02.2020
Grant Number 6873247
Grant Date 22.04.2021
Publication Kind B2
IPC
G01R 1/067
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
G01R 31/26
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26Testing of individual semiconductor devices
CPC
G01R 1/0416
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
04Housings; Supporting members; Arrangements of terminals
0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
0416Connectors, terminals
G01R 1/06722
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
06716Elastic
06722Spring-loaded
G01R 1/06738
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
06733Geometry aspects
06738related to tip portion
G01R 31/2808
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
2808Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
Applicants リーノ インダストリアル インコーポレイテッド
Inventors ベク,ソン-ハ
Agents 伊東 忠重
伊東 忠彦
大貫 進介
Title
(JA) 検査用プローブ及びソケット
Abstract
(JA)

曲面筒状の被検査接触端子を有する被検査体の検査用プローブを提供する。
検査用プローブは、V状に設けられ、前記被検査接触端子の相互離隔された位置にそれぞれ接触する一対の接触面を有する接触部と、前記接触部から長さ方向に沿って後方に一体に延長する延長部とを有する第1接触部材を備える。本発明の検査用プローブによれば、スマートフォン用の超小型カメラモジュールのような被検査体の部分曲面筒状の被検査接触端子に効果的に接触して検査エラーを防止することができる。


Related patent documents