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1. JP2020085426 - ヒートシンク

Office Japan
Application Number 2018225970
Application Date 30.11.2018
Publication Number 2020085426
Publication Date 06.09.2019
Grant Number 6582114
Grant Date 06.09.2019
Publication Kind B1
IPC
F28D 15/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02in which the medium condenses and evaporates, e.g. heat-pipes
F28D 15/04
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02in which the medium condenses and evaporates, e.g. heat-pipes
04with tubes having a capillary structure
H01L 23/36
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
42Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
H05K 7/20
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
F28D 15/0266
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
0266with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
F28D 15/04
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
04with tubes having a capillary structure
F28F 1/26
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
1Tubular elements; Assemblies of tubular elements
10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
12the means being only outside the tubular element
24and extending transversely
26the means being integral with the element
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
H05K 7/20336
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2029using a liquid coolant with phase change in electronic enclosures
20336Heat pipes, e.g. wicks or capillary pumps
Applicants 古河電気工業株式会社
Inventors 川畑 賢也
佐々木 泰海
渡邉 陽介
Agents アインゼル・フェリックス=ラインハルト
前川 純一
二宮 浩康
上島 類
住吉 秀一
Title
(JA) ヒートシンク
Abstract
(JA)

【課題】本発明は、受熱部における入熱の均一化と受熱部の体積を増大でき、発熱体からの発熱量が増大しても受熱部における熱抵抗の増大を防止して、冷却対象に対して優れた冷却性能を発揮できるヒートシンクを提供することを目的とする。
【解決手段】発熱体と熱的に接続される受熱部を有する熱輸送部材と、該熱輸送部材の断熱部または放熱部にて接続された管体と、該管体と熱的に接続された、複数の放熱フィンが配置された放熱フィン群と、を備え、前記熱輸送部材が、前記受熱部から前記管体との接続部まで連通し、且つ作動流体が封入された一体である内部空間を有し、前記熱輸送部材の内部空間が、前記管体の内部空間と連通したヒートシンク。
【選択図】図1

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