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1. JPWO2019053840 - 電子モジュール及び電子モジュールの製造方法

Office Japan
Application Number 2019517863
Application Date 14.09.2017
Publication Number WO2019053840
Publication Date 21.03.2019
Grant Number 6732118
Grant Date 09.07.2020
Publication Kind B2
IPC
H05K 1/14
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
H05K 3/46
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
CPC
H01L 21/565
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
565Moulds
H01L 23/051
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape ; of the container or parts, e.g. caps, walls
043the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
051another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
H01L 23/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
16Fillings or auxiliary members in containers ; or encapsulations; , e.g. centering rings
H01L 23/3735
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
H01L 23/4334
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
433Auxiliary members ; in containers; characterised by their shape, e.g. pistons
4334Auxiliary members in encapsulations
H01L 23/49811
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
Applicants 新電元工業株式会社
Inventors 松嵜 理
池田 康亮
Agents 大野 聖二
大野 浩之
Title
(JA) 電子モジュール及び電子モジュールの製造方法
Abstract
(JA)

電子モジュールは、第一基板11と、前記第一基板11の一方側に設けられた電子素子13,23と、前記電子素子13,23の一方側に設けられた第二基板21と、前記第一基板11と前記第二基板21との間に設けられた第一連結体210と、前記第一基板11と前記第二基板21との間に設けられ、前記第一連結体210よりも長さの短い第二連結体220と、少なくとも前記電子素子を封止する封止部90と、を有する。前記第一連結体210は前記電子素子と電気的に接続されず、前記第二連結体220は前記電子素子13,23と電気的に接続される。