JP2015503851 腐食保護されたボンディング接続部を有する電子デバイス、及び、該電子デバイスの製造方法

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Japan

Application Number 2014551543

Application Date 29.11.2012

Publication Number 2015503851

Publication Date 02.02.2015

Grant Number 5955412

Grant Date 24.06.2016

Publication Kind B2

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Applicants ローベルト　ボツシユ　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング

Inventors ヨハネス　デュル
ロルフ　ベッカー
スヴェン　ラーマース
ルッツ　ミュラー
ファビアン　ベーツ
ミヒャエル　シュレヒト

Agents アインゼル・フェリックス＝ラインハルト
久野　琢也

Priority Data 102012200273 11.01.2012 DE

Title

(JA) 腐食保護されたボンディング接続部を有する電子デバイス、及び、該電子デバイスの製造方法

Abstract

(JA)

本発明は、腐食保護されたボンディング接続部を有する電子デバイス（１）と、該電子デバイスの製造方法に関する。電子デバイス（１）は、基板（４）上に少なくとも１つの半導体チップ（３）を有する。半導体チップ（３）上には、少なくとも１つの腐食の危険があるボンディング接続部が設けられている。少なくとも１つの前記半導体チップ及び少なくとも１つの腐食の危険がある前記ボンディング接続部は、気密封止するケーシング（５）によって取り囲まれている。前記ボンディング接続部は、ボンディングワイヤ接続部（２）であり、前記ボンディングワイヤ接続部（２）は、前記ケーシング（５）の中で完全に気密封止されている。前記基板（４）は、前記ケーシング（５）の中で少なくとも部分的に気密封止されており、前記基板（４）の上には、少なくとも１つの表面実装可能な加水分解性の構成部材（６）が配置されている。

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50	Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60	Attaching leads or other conductive members, to be used for carrying current to or from the device in operation

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
16	Fillings or auxiliary members in containers, e.g. centering rings
18	Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
26	including materials for absorbing or reacting with moisture or other undesired substances

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50	Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60	Attaching leads or other conductive members, to be used for carrying current to or from the device in operation

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
16	Fillings or auxiliary members in containers, e.g. centering rings
18	Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
26	including materials for absorbing or reacting with moisture or other undesired substances

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23	Details of semiconductor or other solid state devices
02	Containers; Seals
04	characterised by the shape ; of the container or parts, e.g. caps, walls
053	the container being a hollow construction and having an insulating ; or insulated; base as a mounting for the semiconductor body

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1. JP2015503851 - 腐食保護されたボンディング接続部を有する電子デバイス、及び、該電子デバイスの製造方法

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24	Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42	Wire connectors; Manufacturing methods related thereto
44	Structure, shape, material or disposition of the wire connectors prior to the connecting process
45	of an individual wire connector

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24	Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42	Wire connectors; Manufacturing methods related thereto
47	Structure, shape, material or disposition of the wire connectors after the connecting process
48	of an individual wire connector

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224	Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02	Bonding areas; Manufacturing methods related thereto
04	Structure, shape, material or disposition of the bonding areas prior to the connecting process
05	of an individual bonding area
0554	External layer
05599	Material
056	with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
05617	the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
05624	Aluminium [Al] as principal constituent

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224	Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01	Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42	Wire connectors; Manufacturing methods related thereto
44	Structure, shape, material or disposition of the wire connectors prior to the connecting process
45	of an individual wire connector
45001	Core members of the connector
4501	Shape
45012	Cross-sectional shape
45015	being circular