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1. JP2013141015 - MULTI-LEVEL LOAD LOCK CHAMBER, TRANSFER CHAMBER, AND ROBOT SUITABLE FOR INTERFACING WITH THE SAME

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Office Japan
Application Number 2013051921
Application Date 14.03.2013
Publication Number 2013141015
Publication Date 18.07.2013
Publication Kind A
IPC
H01L 21/677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
CPC
H01L 21/67742
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67739into and out of processing chamber
67742Mechanical parts of transfer devices
H01L 21/67201
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67155Apparatus for manufacturing or treating in a plurality of work-stations
67201characterized by the construction of the load-lock chamber
Y10S 414/135
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
414Material or article handling
135Associated with semiconductor wafer handling
Y10T 29/49826
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
49Method of mechanical manufacture
49826Assembling or joining
Applicants APPLIED MATERIALS INC
アプライド　マテリアルズ　インコーポレイテッド
Inventors ROBERT B MOORE
ムーア，　ロバート　ビー．
ERIC RUHLAND
ルーランド，　エリック
SATISH SUNDAR
サンダー，　サティッシュ
MARIO DAVID SILVETTI
シルヴェッティ，　マリオ　デイヴィッド
Agents 園田　吉隆
小林　義教
Priority Data 11424461 15.06.2006 US
Title
(EN) MULTI-LEVEL LOAD LOCK CHAMBER, TRANSFER CHAMBER, AND ROBOT SUITABLE FOR INTERFACING WITH THE SAME
(JA) 複数レベルのロードロックチャンバ、移送チャンバ、及びこれにインターフェイスするのに適したロボット
front page image
Abstract
(EN)

PROBLEM TO BE SOLVED: To provide a load lock chamber system which improves the throughput of substrate processing.

SOLUTION: A multi-level load lock chamber 100 having four environmentally separated chambers has a robot 600 for a transfer chamber and is interfaced with a transfer chamber 400 connected with a process chamber 16. The robot 600 for the transfer chamber has two arm assemblies 608, 616 which move in a horizontal direction when the robot rotates around its axis. These arms reach the separated chambers in the load lock and receive substrates from the separated lower chambers 224, 226 which are located at a bottom part. The arms also transfer the substrates to the process chamber 16 and put the substrates into the upper chambers 220, 222 after the processing. Each separated chamber in the load lock chamber includes a lid 306 that is pivotally fitted and may be opened for allowing access to the interior of the separated chamber.

COPYRIGHT: (C)2013,JPO&INPIT

(JA)

【課題】基板処理のスループットを高めることの出来るロードロックチャンバシステムを提供する。
【解決手段】４つの環境的に分離されたチャンバを有する複数レベルのロードロックチャンバ１００が、移送チャンバ用ロボット６００を有すると共に、プロセスチャンバ１６と接続させている移送チャンバ４００とインターフェイスされる。移送チャンバ用ロボット６００は、ロボットがその軸の周りで回転するときに水平方向に各々移動できる２つのアームアセンブリ６０８、６１６を有し、これらのアームは、ロードロック内の分離されたチャンバに届き、底部の分離された下部チャンバ２２４、２２６から基板を受け入れ、基板をプロセスチャンバ１６へ搬送し、処理後、基板を上部チャンバ２２０、２２２へ入れることができる。ロードロックチャンバ内の分離されたチャンバは、分離されたチャンバの内部にアクセスするために開くことのできる枢着された蓋３０６を含む。
【選択図】図２
Also published as
CN101432856
JP2009540613
KR1020090007367
US20070292244
US20090092466
WO/2007/146643
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