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1. JP2014150092 - DISPOSITION DETERMINATION SUPPORT DEVICE AND DISPOSITION DETERMINATION SUPPORT METHOD OF LOWER RECEIVING PINS

Office
Japan
Application Number 2013016523
Application Date 31.01.2013
Publication Number 2014150092
Publication Date 21.08.2014
Publication Kind A
IPC
H05K 13/04
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components
Applicants PANASONIC CORP
パナソニックIPマネジメント株式会社
Inventors TAKEHARA YUKI
竹原 裕起
YOKOI TAKAAKI
横井 敬明
Agents 藤井 兼太郎
鎌田 健司
前田 浩夫
Title
(EN) DISPOSITION DETERMINATION SUPPORT DEVICE AND DISPOSITION DETERMINATION SUPPORT METHOD OF LOWER RECEIVING PINS
(JA) 下受けピンの配置決定支援装置および配置決定支援方法
Abstract
(EN)

PROBLEM TO BE SOLVED: To provide a disposition determination support device and a disposition determination support method of lower receiving pins capable of appropriately disposing lower receiving pins while considering component layout on a surface on which components have been mounted and an objective surface to be mounted with components.

SOLUTION: The disposition determination support device determines the disposition of lower receiving pins for supporting a substrate 3 having already mounted components from the bottom thereof. After displaying a first substrate image representing a surface having already mounted components and a second substrate image representing a surface to be mounted with components are displayed, a pin disposition image in which disposition positions SP1-SP6 of a lower receiving pin module 22 are input is overlapped with the first substrate image or the second substrate image. In a pin picture display processing to display a synthetic picture, a synthetic picture based on the first substrate image and a synthetic picture based on the second substrate image are displayed being switched with each other. With this, a proper disposition of lower receiving pins is achieved considering the component layout of supporting components existing under a plane to be mounted with components.

COPYRIGHT: (C)2014,JPO&INPIT


(JA)

【課題】既実装面のみならず実装対象面における部品配置をも考慮に入れた適正な下受けピン配置が可能な下受けピンの配置決定支援装置および配置決定支援方法を提供することを目的とする。
【解決手段】基板3の既実装面を下面側から下受けする下受けピンの配置の決定に際し、既実装面を示す第1の基板画像および実装対象面を示す第2の基板画像を含む画像を表示させ、表示された画像上に下受けピンモジュール22の配置位置SP1〜SP6が入力されたピン配置画像を第1の基板画像または第2の基板画像に重ねた合成画像を表示させるピン画像表示処理において、第1の基板画像に基づく合成画像と第2の基板画像に基づく合成画像とを切り替えて表示させる。これにより、実装装対象面に存在する下受け要部品の部品配置をも考慮に入れた適正な下受けピン配置が可能となる。
【選択図】図10